Shanghai Yongxing Electronic Switch Co., Ltd. has rich manufacturing experience, strong technical force, advanced production and testing equipment, the company's SMT workshop covers an area of 1,200 square meters, currently has a single-track SMT SMD production line, 1 DIP welding line, and later plans to increase 5 SMT production lines, 2 DIP welding line. 2022 the company has introduced fully automatic solder paste printing machine, automatic high-speed In 2022, the company successively introduced fully automatic solder paste printing machine, fully automatic high-speed SMD machine, 2D AOI optical inspection, on-line 3D SPI and other advanced inspection equipment, which can meet the needs of customers for a variety of products.

 

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Technical Brief

 

SMT (Surface Mount Technology) technology is an electronic assembly technology used to mount electronic components directly to the surface of a printed circuit board (PCB), rather than by means of insertion.

 

The basic principle of SMT technology is that electronic assembly is achieved through the use of Surface Mount Devices (SMDs), which are miniaturized electronic components whose pins are attached to the PCB with a flat surface, rather than the traditional pin or socket connections. SMDs are miniaturized electronic components whose pins are attached to the PCB with a flat surface instead of the traditional pin or socket connections. These SMDs include integrated circuits, resistors, capacitors, transistors, and a variety of other components known as "chips".

 

Through SMT technology, electronic components can be more tightly integrated on the PCB, realizing high-density assembly and improving circuit performance, reliability and production efficiency. It has become one of the key technologies widely used in modern electronics manufacturing.

 

Strength

 

1. Advanced equipment and technology: The company has invested in advanced SMT equipment and technology, including high-speed placement machines, precision reflow ovens, and automatic optical inspection (AOI). These equipments and technologies are capable of realizing efficient, precise and reliable electronic assemblies, improving production efficiency and quality level.

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2. Rich experience and professional team: The company has rich experience and professional team in SMT processing. The technicians are familiar with SMT process and equipment operation, and are able to perform complex assembly tasks and process optimization. They have good technical knowledge and problem solving ability to ensure high quality product delivery.

 

3. Flexible production capacity: The company has flexible production capacity to meet the different needs of customers. Whether it is small sample production or large-scale production, the company is able to respond quickly and provide efficient solutions. Flexible production capacity can help customers shorten time-to-market and improve market competitiveness.

 

4. Quality control and certification: The company emphasizes quality control and adopts a strict quality management system. The quality and consistency of each assembly is ensured by means of automatic optical inspection (AOI), X-ray inspection (X-ray) and functional testing. It has also obtained ISO 9001 quality management system certification, so product quality reliability and compliance can be trusted.

 

5.Multi-industry application experience: the company has multi-industry SMT processing application experience. Whether it is consumer electronics, automotive electronics, medical equipment or industrial automation, the company is able to customize electronic assembly according to the requirements of different industries. Rich industry experience enables the company to understand customer needs and provide appropriate solutions.

 

Equipment Process
 

 

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Automatic high speed mounter

Automatic high speed mounter

Details:
Equipment Model: NPM W2
PCB size(mm): 750x550/50x50
Theoretical speed: 0.047sec/chip 77000/H
Actual speed: 70,000/H
Mounting accuracy: Chip: ±40um QFP: ±30um
Component range: 01005/0201/0402 Lead pitch:0.4mm
Equipment use: SMD vacuum suction identification after accurate placement on the PCB.

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Automatic solder paste printing machine

Automatic solder paste printing machine

Details:
Equipment Model: G5+
PCB size (mm): 400*340mm Expandable: 530*340mm (option) / 50×50
Printing speed: 10-200mm/sec
Squeegee pressure 0.5-10Kg
Printing finest pitch 0.4mm
Component range: 32×32mm QFP Lead pitch:0.4mm
Equipment use:Accurately print the solder paste on the PCB board.

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In-line 3D SPI

In-line 3D SPI

Details:
Device Model: TU530
PCB size (mm): 510*460mm/50*50mm
Camera configuration: 5 megapixel high-speed camera
Optical resolution: 10um
FOV size: 25mm*20mm
Detection speed: 3FOV/SEC
Maximum plate bend compensation value: ±5mm
Height resolution: 0.37um
Height accuracy (calibration module): 1um (using standard calibration block)
Volume repeatability: 1% (standard calibration block, 35igma)
Equipment use: detect the volume, area, height, XY position offset, shape, etc. of the solder paste after printing. Defective types: more tin, less tin, leakage of printing, pull tip, bridge link, offset, bad shape, etc.

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In-line 2D AOI

In-line 2D AOI

Equipment Model: TU820
PCB size (mm): 510*460mm/50*50mm
Camera configuration: 1200 megapixel high-definition color camera
Optical resolution: 10um
FOV size: 40mm*30mm
Detection speed:3FOV/SEC
Minimum part: 01005 Chip,0.3Pitch
Part height limitation: Top: 40mm Bottom: 55mm Side: 3mm
Platform positioning accuracy: 1um (using standard calibration block)
Equipment use: test reflow soldering after the PCBA mounting, soldering quality.
Detection items: more tin, less tin, even tin, missing parts, offset, skewed, monument, reverse parts, polarity, wrong parts, broken, empty weld, multiple parts, scratches and so on.

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Lead-free reflow soldering

Lead-free reflow soldering

Equipment Model: JTR-1000II
Maximum width of PCB(mm): 400mm
Number of heating/cooling zones: upper 10, lower 10 heating zones, upper 3/lower 3 cooling zones
Temperature control range: room temperature -300°C
PCB board component height: 30mm on the board / 25mm under the board
PCB transportation mode: single rail + mesh belt transportation
Transportation speed: 300-2000mm/min
Cooling method: forced air cooling
Equipment Use: Fully adapted to high-performance lead-free soldering process, suitable for all SMT components such as BGA\CSP\0201 soldering needs.

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Leaded wave soldering

Leaded wave soldering

Equipment Model: SMART-350II-M (High-end automatic + external spray)
PCB width range (mm): 50 ~ 3500mm
Preheating zone number and mode: 3 bottom hot air
Spraying system: Spraying outside the ordinary full spraying
Temperature control range: room temperature - 230 ° C
Height of components on PCB board: 30mm above the board / 25mm below the board
Transportation Claw: Heavy duty double hook claw
Transportation speed: 300-1800mm/min
Cooling mode: forced air cooling
Equipment use: electronic products plug-in welding, through the melting solder will be inserted in the circuit board plug-in electronic components and circuit board pads welded together.

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Cooperative Partner

 

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